15 credits at level HE7
This module is a first introduction at postgraduate level to the technological aspects of microelectronic design. It takes a wide view of the subject and includes fabrication, packaging and testing of IC devices, CAD, gate arrays, full custom, design for test, low level transistor design, analogue and digital building blocks, aspects of quality and reliability, EMC, current trends and likely future developments. Most of these topics receive a more detailed treatment in subsequent modules
If you are planning to study a number of modules with a view to obtaining a qualification, this is a good one to start with. Many students follow this module with Microelectronic Technologies and Applications but either module can be studied in isolation and they may be studied in the opposite order.
Who can benefit?
This module is relevant to anyone with an electronics training who has not previously worked in microelectronics. It is also likely to be useful to people with experience of microelectronics production who are planning to moving to a design role. The module can be studied on its own or as part of a programme leading to a formal qualification.
The aims of the module are:
- to develop an appreciation of the techniques applicable to the design of analogue and digital microelectronic systems.
- to enable the student to evaluate critically the specification and system requirements necessary for the design and production of microelectronic circuits.
- to give the student an understanding of analogue and digital circuit techniques.
Microelectronic system design, implementation and test
Design as a process, nature of the manufacturing stages (including test and chip packaging), methodology (the method of design to be adopted), developing technical specifications, management of the design process, including reviews, modelling and the use of CAD tools, cost factors, design for manufacture, EMC and thermal issues.
Analogue circuit techniques
Constant current sources, constant voltage sources, voltage references.
Digital circuit techniques
Design and implementation of combinational and sequential logic circuits, circuit implementation using PLDs.
Each part of the syllabus includes applications to illustrate the technique.
The module is expected to involve 150 hours learning time spread over 12 weeks. All study and assessment is carried out via the internet so there is no requirement to attend in person. The approach is substantially student centered, with tutor support by email and telephone on a one-to-one basis, although peer discussion is encouraged. Typically the generality of a concept is introduced in the online text and the student is then directed to a variety of information sources to research and analyse the subject area further, reflect and draw appropriate conclusions. Self-assessment questions (SAQs) throughout the module reinforce the concepts and help students to monitor their progress and the effectiveness of their study. The module is assessed by two equally weighted assignments.
when you have successfully completed this module you will:
to demonstrate that you have achieved the learning outcome you will:
|1.||be able to determine a suitable technology design approach to meet a given requirement.||
evaluate the business and technical considerations in aspects of microelectronic design such as cash flow and functional specifications, chip size and manufacturing requirements.
Select an appropriate circuit technology.
|2.||be able to evaluate the constraints associated with different design approaches.||undertake a design case study for a digital or analogue system application and advise on associated business issues.|
Your achievement of the learning outcomes for this module will be tested as follows:
|Description||Demonstrate understanding of the course material by answering a set of questions covering aspects of the ASIC design flow.||Produce a detailed product specification and development plan covering diverse aspects of the design flow, including EMC, prototyping, system specification, user interface and manufacturing flow.|
There are no prerequisites for this module.
No restrictions apply.
Core text: Shepherd, Peter R. Integrated Circuit Design, Fabrication and Test, Macmillan Press Ltd, 1996, ISBN 0-333-63039-4
Tummala, Rao R. & Rymaszewski, E.J. Microelectronics Packaging Handbook - Volume 2 Semiconductor Packaging, Chapman & Hall, 1997, ISBN 0-412-08441-4
Jensen, Finn Electronic Component Reliability, John Wiley & Sons, 1995, ISBN 0-471-95296-6
Price, T.E. Introduction to VLSI Technology, Prentice Hall, 1994, ISBN 0-13-500422-5
Williams, T. EMC for Product Designers, 2nd Edition, Butterworth-Heinemann Ltd, 1996, ISBN 0-750-62466-3
Buchanan, R. Microelectronic System Design, Modelling and Testing, Arnold, 1997, ISBN 0-340-67771-6
Smith, M.J.S. Application Specific Integrated Circuits, Addison Wesley, 1997, ISBN 0-201-50022-1
Brown, William D. Advanced Electronic Packaging, IEEE Press, 1999, ISBN 0-780-34700-5
Licari, James J., Multichip Module Design, Fabrication and Testing, McGraw Hill, 1994, ISBN 0070377154
Journals, for example:
- Electronics Letters
- Electronic Engineering
- IEEE Transactions on Circuit and Systems
- IEEE Transactions on Industry Applications
- IEEE Transactions on Industrial Electronics
- IEEE Transactions on Consumer Electronics
|Host Subject Group:|
|User Name||Date Accessed||Action|