20 credits at level HE7
Signal Integrity is a key issue in the design of electronic based products and in particular printed circuit boards (PCBs). As digital circuits operate at higher and higher clock speeds, signal integrity becomes increasingly more important. The PCB can dramatically alter the performance of circuits and it should be considered as a major component that impacts on the design activity at an early stage.
Compliance with European Directives for products that are to be used in the European Community is a legal requirement and should be taken into account in the design phase of a product. The Electromagnetic Compatibilty Directive (EMC) is of particular importance in the design of electronic based products.
Signal integrity and EMC are interrelated and this module covers both topic areas.
Who can benefit?
Electronic system designers, circuit designers, PCB designers and mechanical engineers wishing to extend their areas of competence in these important topics. The module can be studied on its own or as part of a programme leading to a formal qualification.
- to understand the concepts of signal integrity and relate them to the performance of electronic based products.
- to enable students to appreciate electromagnetic phenomena and relate them to electromagnetic compatibility (EMC) and product performance.
Regulatory Compliance in the European Community and the CE mark
Overview of the EMC Directives
EMC test Methods
review of EMC test methods
full compliance testing
Relevant Electromagnetic Field Theory
time varying fields
The Impact of EMC & LVD on the Product Design Phase
susceptibility to radiation
emissions, radiated and conducted
transients on input/output leads
surges on mains and input/output leads
electrostatic discharge, case design, connectors and PCB design
electromagnetic radiation and PCB design
Digital Signal Integrity
signal integrity overview
noise immunity and noise margin
distortion of digital signals
transmission line design techniques
power supplies in high speed systems
PCB design issues
Finite element analysis
Overview of finite element methods
Field plotting using finite element software
Applications of field plotting software to PCB design
The module is expected to involve 200 hours learning time spread over 12 weeks. All study and assessment is carried out via the internet so there is no requirement to attend in person. The approach is substantially student centred, with tutor support by email and telephone on a one-to-one basis, although peer discussion is encouraged. Typically the generality of a concept is introduced in the online text and the student is then directed to a variety of information sources to research and analyse the subject area further, reflect and draw appropriate conclusions. Online simulation, exercises and self-assessment questions (SAQs) throughout the module reinforce concepts and help students to monitor their progress and the effectiveness of their study. The module is assessed by two assignments, weighted 30% and 70%. Each assignment includes practical simulations and will involve design work based on realistic applications.
when you have successfully completed this module you will:
to demonstrate that you have achieved the learning outcome you will:
|1.||understand and apply ESD concepts to product cases and enclosures||analyse representative product enclosures and interconnects|
|2.||understand the causes of surges and assess their affect on product performance||analyse the effects of surges on external product interconnects|
|3.||be able to assess the effects of EMC on electronic product performance||analyse PCB interconnect topologies for both radiation and susceptibility|
|4.||appreciate how the degradation of signal integrity affects electronic product performance||analyse PCB interconnect topologies for signal degradation, including propagation delays and signal reflections.|
Your achievement of the learning outcomes for this module will be tested as follows:
|Description||Analyse, using simulation techniques, defined PCB topologies to determine engineering parameters||Analyse specified system and circuit elements, using simulation techniques, for EMC and signal integrity performance|
There are no prerequisites for this module.
No restrictions apply.
Williams T, EMC for Product Designers, 3rd edition, Newnes, 2005, ISBN 0750649305
Bogatin E, Signal Integrity Simplified , 4th printing, Prentice Hall, 2004, ISBN 0130669466
Kraus, John D. et al., Electromagnetics (with Applications), 5th edition, McGraw-Hill, 1999, ISBN 0071164294
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